Category: EECS: Electrical and Computer Engineering
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National Academy of Inventors to induct Jay Guo
Guo is recognized for advances in nanoscale lithography, transparent conductors and structural color.
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Games for rehab: Fast communication for interactive VR and AR
U-M-led team to tackle latency for wheelchair-friendly AR/VR soccer matches and large-scale VR word puzzles for players fending off the progression of Parkinson’s.
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New process layers uniform ScAlN on 3D surfaces
Scandium aluminum nitride can now be integrated into high-voltage, high-frequency or piezoelectric devices with plasma-enhanced atomic layer deposition.
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U-M quantum testbed enables remote experiments
The optical fibers connecting two quantum research labs at the University of Michigan mark the first piece of a local quantum network and remote user test facility.
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Nano-switch achieves first directed, gated flow of excitons
Moving excitons with light and a nano-ridge could help bridge optics and electronics, enabling new devices and faster, more efficient communication.
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Michigan Plasma Prize honors Lawrence Berkeley Lab physicist
Eric Esarey, Michigan Engineering alumnus and leader in laser-plasma accelerators, receives 2025 award.
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University of Michigan startup Ambiq goes public
NSF-funded research led to ultra efficient chip used in wearables and medical devices.
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Efficiency upgrade for OLED screens: A route to blue PHOLED longevity
Commercial devices currently settle for less efficient blue OLEDs, but a set of design innovations has made an efficient blue that is as durable as efficient green OLEDs.
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Advances in organic electronics and optoelectronics
NAE profile: Stephen Forrest, electrical and computer engineering
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Advancing microelectronics and integrating sensor technologies
NAE profile: Kensall Wise, electronics, communication & information systems specialist
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The US has a new most powerful laser
Hitting 2 petawatts, the NSF-funded ZEUS facility at U-M enables research that could improve medicine, national security, materials science and more.
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Careful heating unlocks unprecedented sensitivity to pressure in semiconductor materials
A simple and scalable annealing method boosts the quality of materials used in cell phones, sensors and energy harvesting devices.